varistor products ?2010 littelfuse, inc. revision: june 28, 2010 mhs varistor series surface mount multilayer varistors (mlvs) > mhs series speci?cations are subject to change without notice. please refer to www.littelfuse.com/series/mhs.html for current information. mhs series mhs varistor series rohs description the multilayer highCspeed mhs series is a very-low capacitance extension to the littelfuse ml family of transient voltage surge suppression devices available in an 0402 and 0603Csize surface mount chip. the mhs series provides protection from esd and eft in highCspeed data line and other high frequency applications. the low capacitance of the mhs series permits usage in analog or digital circuits where it will not attenuate or distort the desired signal or data. their small size is ideal for highCdensity printed circuit boards, being typically applied to protect intergrated circuits and other sensitive components. they are particularly well suited to suppress esd events including those speci?ed in iec 61000-4-2 or other standards used for electromagnetic compliance (emc) testing. the mhs series is manufactured from semiconducting ceramics and is supplied in a leadless, surface mount package. the mhs series is also compatible with modern re?ow and wave soldering prcesses. littelfuse inc. manufactures other multilayer varistor series products, see the ml, mle, mln and auml series data sheets. features ? aec - q200 compliant ? rohs compliant ? 3pf, 12pf, and 22pf capacitance versions suitable for highCspeed data rate lines ? esd rated to iec 61000-4-2 ( level 4) ? eft/b rated to iec 61000-4-4 ( level 4) ? low leakage currents ? -55oc to +125oc operating temp. range ? inherently bi-directional applications ? data, diagnostic i/o ports ? universal serial bus (usb) ? video & audio ports ? portable/hand- held products ? mobile communications ? computer/dsp products ? industrial instruments including medical absolute maximum ratings size table metric eia 1005 0402 1608 0603 ? for ratings of individual members of a series, see device ratings and speci?cations table. continuous mhs series units steady state applied voltage: dc voltage range (v m(dc) ) : v0402/0603mhs03 42 v v0402/0603mhs12 18 v v0402/0603mhs22 09 v operating ambient temperature range (t a ) -55 to +125 o c storage temperature range (t stg ) -55 to +150 o c
varistor products ?2010 littelfuse, inc. revision: june 28, 2010 mhs varistor series surface mount multilayer varistors (mlvs) > mhs series speci?cations are subject to change without notice. please refer to www.littelfuse.com/series/mhs.html for current information. device ratings and speci?cations part number performance speci?cations (25 oc) maximum clamping voltage at 1a (8x20 s) maximum esd clamp voltage (note 1) typical leakage current at speci?ed dc voltage typical capacitance at 1mhz (1v p-p) typical inductance (from impedance analysis) 8kv contact (note 2) 15kv air (note 3) 3.5v 5.5v c (note 4) l clamp clamp p i l min max (v c ) (v) (v) ( a) ( a) (pf) (pf) (nh) V0402MHS03N (note 5) 135 <300 <400 0.5 1.00 2 5 <1.0 v0603mhs03n 135 <300 <400 0.5 1.00 1 6 <1.0 v0402mhs12n (note 5) 55 <125 <160 0.5 1.00 8 16 <1.0 v0603mhs12n 55 <125 <160 0.5 1.00 8 16 <1.0 v0402mhs22n (note 5) 30 <125 <160 0.5 1.00 15 29 <1.0 v0603mhs22n 30 <65 <100 0.5 1.00 15 29 <1.0 notes: 1. tested to iec-61000-4-2 human body model (hbm) discharge test circuit. 2. direct discharge to device terminals (iec preferred test method). 3. corona discharge through air (represents actual esd event). 4. capacitance may be customized, contact your littelfuse sales representative. 5. v0402mhsxxx (0402 size devices) available as "r" packaging option only. example: V0402MHS03Nr. see packaging and tape and re el sections (last page) for additional information. for applications exceeding 125oc ambient temperature, the peak surge current and energy ratings must be reduced as shown below. peak current and energy derating curve 60 10 1 number of pulses nominal voltage at 1madc 10 100 1000 10000 20 30 40 50 v0402mhs03 v0402mhs12 v0603mhs03 v0603mhs12 0 v0402mhs22 v0603mhs22 nominal voltage stability to multiple esd impulses (8kv contact discharges per iec 61000-4-2) standby current at normalized varistor voltage and temperature insertion loss (s21) characteristics 1. 2 0.0 0.0001 25 0.001 0.01 0.1 1 current (ma) normalized varistor voltage (v) 1. 0 0.8 0.6 0.4 0.2 85 125 o o o 100 80 60 40 20 0 -55 50 60 70 80 90 100 110 120 130 140 150 percent of rated value ambient temperature ( o c) -30 frequency (mhz) insertion loss (db) 10 100 1000 10000 -20 -10 0 v0402mhs22 v0603mhs22 v0402mhs12 v0402mhs03 v0603mhs12 v0603mhs03 figure 1 figure 2 figure 3 figure 4
varistor products ?2010 littelfuse, inc. revision: june 28, 2010 mhs varistor series surface mount multilayer varistors (mlvs) > mhs series speci?cations are subject to change without notice. please refer to www.littelfuse.com/series/mhs.html for current information. mhs series lead (pb) soldering recommendations the principal techniques used for the soldering of components in surface mount technology are ir re-?ow and wave soldering. typical pro?les are shown on the right. the recommended solder for the mhs suppressor is a 62/36/2 (sn/pb/ag), 60/40 (sn/pb) or 63/37 (sn/pb). littelfuse also recommends an rma solder ?ux. wave soldering is the most strenuous of the processes. to avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. when using a re?ow process, care should be taken to ensure that the mhs chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. during the soldering process, preheating to within 100 degrees of the solder's peak temperature is essential to minimize thermal shock. once the soldering process has been completed, it is still necessary to ensure that any further thermal shocks are avoided. one possible cause of thermal shock is hot printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. the boards must be allowed to cool gradually to less than 50oc before cleaning. 230 re?ow solder pro?le wave solder pro?le device characteristics at low current levels, the v-i curve of the multilayer transient voltage suppressor approaches a linear (ohmic) relationship and shows a temperature dependent effect. at or below the maximum working voltage, the suppressor is in a high resistance model (approaching 10 6 at its maximum rated working voltage). leakage currents at maximum rated voltage are below 100 a, typically 25 a; for 0402 size below 20 a, typically 5 a. 100% 1e -9 1e -8 suppressor current (a dc ) 10% 1e -7 1e -6 1e -5 1e -4 1e -3 1e -2 25 50 75 100 125 o c suppressor voltage in percent of v nom value at 25 o c (%) o o o o typical temperature dependance of the characteristic curve in the leakage region speed of response the multilayer suppressor is a leadless device. its response time is not limited by the parasitic lead inductances found in other surface mount packages. the response time of the z n o dielectric material is less than 1ns and the mle can clamp very fast dv/dt events such as esd. additionally, in real world applications, the associated circuit wiring is often the greatest factor effecting speed of response. therefore, transient suppressor placement within a circuit can be considered important in certain instances. grains depletion fired ceramic dielectric region metal electrodes depletion region metal end termination multilayer internal construction figure 5 figure 6 figure 7 figure 8
varistor products ?2010 littelfuse, inc. revision: june 28, 2010 mhs varistor series surface mount multilayer varistors (mlvs) > mhs series speci?cations are subject to change without notice. please refer to www.littelfuse.com/series/mhs.html for current information. product dimensions (mm) note: avoid metal runs in this area, parts are not recommended for use in applications using silver (ag) epoxy paste. d e w l dimension 0402 size 0603 size in mm in mm a 0.067 1.700 0.100 2.540 b 0.020 0.510 0.030 0.760 c 0.024 0.610 0.035 0.890 d (max.) 0.024 0.600 0.040 1.000 e 0.10 +/- 0.006 0.25 +/- 0.15 0.015 +/- 0.008 0.4 +/- 0.2 l 0.039 +/- 0.004 1.00 +/- 0.10 0.063 +/- 0.006 1.6 +/- 0.15 w 0.020 +/- 0.004 0.50 +/- 0.10 0.032 +/- 0.006 0.8 +/- 0.15 pad layout demensions chip layout dimensions 5.0 6.0 7.0 maximum temperature 260?c 20 - 40 seconds within 5?c preheat zone ramp rate <3?c/s 60 - 150 sec > 217?c leadCfree (pb-free) soldering recommendations littelfuse offers the nickel barrier termination ?nish for the optimum leadCfree solder performance. the preferred solder is 96.5/3.0/0.5 (snagcu) with an rma ?ux, but there is a wide selection of pastes and ?uxes available with which the nickel barrier parts should be compatible. the re?ow pro?le must be constrained by the maximums in the leadCfree re?ow pro?le. for leadCfree wave soldering, the wave solder pro?le still applies. note: the leadCfree paste, ?ux and pro?le were used for evaluation purposes by littelfuse, based upon industry standards and practices. there are multiple choices of all three available, it is advised that the customer explores the optimum combination for their process as processes vary considerably from site to site. leadCfree re-?ow pro?le figure 10
varistor products ?2010 littelfuse, inc. revision: june 28, 2010 mhs varistor series surface mount multilayer varistors (mlvs) > mhs series speci?cations are subject to change without notice. please refer to www.littelfuse.com/series/mhs.html for current information. mhs series part numbering system v 0402 packing options (see quantities in packaging section) device family littelfuse tvss device r device size 0402 = .04 inch x .02 inch (1.0 mm x 0.5 mm) 0603 = .063 inch x .031 inch (1.6 mm x 0.8 mm) mhs 03 n capacitance designation 03 = 3pf 12 = 12pf 22 = 22pf end termination option n = nickel barrier (ni/sn) series designator mhs = multilayer hi-speed t = (0603 device only)13in (330mm) diameter reel, plastic carrier tape h = (0603 device only) 7in (178mm) diameter reel, plastic carrier tape r = (available for 0402 and 0603 devices) 7in (178mm) diameter reel, paper carrier tape packaging* quantity device size 13 inch reel ("t" option) 7 inch reel ("h" option) 7 inch reel ("r" option) 0603 10,000 2,500 4,000 0402 not available not available 10,000 k 0 t 1 d 0 p 0 d 1 p 1 a 0 p 2 b 0 f e w t tape and reel speci?cations symbol description dimensions in millimeters 0402 size 0603 size a 0 width of cavity dependent on chip size to minimize rotation. b 0 length of cavity dependent on chip size to minimize rotation. k 0 depth of cavity dependent on chip size to minimize rotation. w width of tape 8 -/+ 0.2 8 -/+ 0.3 f distance between drive hole centers and cavity centers 3.5 -/+.05 3.5 -/+.05 e distance between drive hole centers and tape edge 1.75 -/+ 0.1 1.75 -/+ 0.1 p 1 distance between cavity centers 2 -/+ 0.05 4 -/+ 0.1 p 2 axial drive distance between drive hole centers & cavity centers 2 -/+ 0.1 2 -/+ 0.1 p 0 axial drive distance between drive hole centers 4 -/+ 0.1 4 -/+ 0.1 d 0 drive hole diameter 1.55 -/+ 0.05 1.55 -/+ 0.05 d 1 diameter of cavity piercing n/a 1.05 -/+ 0.05 t 1 top tape thickness 0.1 max 0.1 max t nominal carrier tape thickness 1.1 1.1 notes: ? conforms to eia-481-1, revision a ? can be supplied to iec publication 286-3 *(packaging) it is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when re moved from bags.
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